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邮箱:sales@yaentek.cn
YAEN Electronics Technology Co., LTD.
Autodesk|Altium|Cadence|Downstream|Graphicode|Keil|Wise|SiemensEDA正版软件授权代理分销商
Category | Functionality | Z-planner Enterprise | Avishtech Gauss Stack | Frontline Instack Design | Polar Instruments Speedstack SI |
Analysis | Number of DFSI analysis | 21 | 0 | 3? | 0 |
Analysis | Number of stackup DFM analysis | 24 | Yes | ? | ? |
Analysis | Dimensional stability simulation | No | Yes | ||
Analysis | Reliability prediction | No | Yes | ||
Analysis | Warpage simulation | No | Yes | ||
Collaboration | Compare Fab stackups to spec stackups | Yes | No | No | No |
Collaboration | Interfaces to key PCB fabricators | Yes | No | No | Yes |
Collaboration | Interfaces to multiple PCB flows, analysis and DFM tools | Yes | No | No | Yes |
Collaboration | Multi-fabricator Stackup Compare | Coming 2024.1 | No | No | No |
Core Application | Command Line Automation | Coming 2023.2 | No | No | No |
Core Application | Copper roughness modeling | Yes | Yes | Yes | Yes |
Core Application | Glass awareness and glass-weave skew mitigation | Yes | Yes | No | No |
Core Application | Glass stop | Yes | Yes | ||
Core Application | Impedance planning | Yes | Yes | Yes | Yes |
Core Application | Insertion loss planning | Yes | Yes | Yes | Yes |
Core Application | Intuitive user interface for all stakeholders | Yes | No | No | No |
Core Application | Multiple dielectrics per layer | Yes | Yes | Yes | Yes |
Core Application | Pressed thickness | Yes | Yes | Yes | Yes |
Core Application | Rigid/Flex wizard | Coming 2024.1 | No | No | No? |
Core Application | Rigid-Flex support | Yes | No? | Yes | Yes |
Core Application | Sequential lamination awareness | Yes | No? | Yes | Yes |
Core Application | Spec/Fab stackups treated independently | Yes | No? | Yes | No |
Core Application | Stackup wizard | Yes | Yes? | Yes | Yes |
Core Application | Unlimited number of impedances | Yes | Yes? | Yes | Yes |
Core Application | Worldwide customer support | Yes | Limited | Yes | Limited |
Input/Output | Bi-directional interface to HyperLynx SI | Yes | No | Yes | Yes |
Input/Output | Bi-directional interface to Xpedition Layout CM | Yes | No | No | Yes |
Input/Output | Excel import/export | Yes | Yes | ? | Yes |
Input/Output | InStack Import | Yes | No | Yes | No |
Input/Output | IPC-2581 import/export | Yes | Yes | Yes, cost | Rev. B1 only |
Input/Output | ODB++ import/export | Yes | No | No | No? |
Input/Output | Polar stkx import/export | Yes | No | No? | Yes |
Materials Library | Corporate dielectric library | Yes | Yes | Yes | Yes |
Materials Library | Extensive material properties included for each material | Yes | |||
Materials Library | Library data visualization (e.g. radial plots of comparable material) | Yes | No | No | No |
Materials Library | Local/User dielectric library | Yes | Yes | Yes | Yes |
Materials Library | Number of materials families in dielectric library | 264 + 30 solder masks | ? | ? | ? |
Materials Library | Shared reference stackups for design reuse | Yes | No? | No? | No? |
工业软件
国产替代方案
Sailwind
塔格特Target2000
浩辰Gstar CAD
浩辰Gstar 3D
ZWSOFT中望CAD
ZWSOFT中望3D
天河THCAD
Foxit福昕PDF
望友DFx | CAM365
进口正版工业软件
Altium Designer
Valor Process Preparation
Teamcenter Rapid Start
AutoCAD | Inventer
地点:深圳市龙岗区城投商务中心316
联系电话:133 6007 6532
邮箱:sales@yaentek.com
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