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深圳市雅恩信息技术有限公司

YAEN Electronics Technology Co., LTD.

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XpeditionPackage Designer

芯片封装设计软件

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Benefits•Supports physical design of High-Density Advanced Packages (HDAP) including FOWLP, 2.5D/3D, silicon and organic interposers, embedded substrate bridges, System-In-Package and modules•Advanced dynamic metal fill with DFM-ready results including multi-pass degassing, metal balancing and offset hatched planes•Real-time design visualization and editing in 2D and 3D•Concurrent multi-user team design and patented “sketch routing” shrinks design cycle•In-design geometry-based DRC Removes/reduces signoff-driven ECOs•Physical IP block reuse leverages proven IP and reduces design time•Direct creation of SI/PI simulation models with integrated 3D EM solver•Fast high-quality mask generation using either GDSII or OASIS•Full mask LVS and package assembly signoff through direct integration with Calibre 3DSTACK Key features•Proven capacity and interactive performance on the largest designs•Multi-user concurrent team design•ODB++ import for legacy design migration•Fast accurate GDSII and OASIS output•Rapid, on-the-fly connectivity creation via Layout Driven Design•2D/3D editing and visualization all within core layout•Patented sketch-routing technology for the industry’s highest routing productivity•Fast, accurate and mask-ready area fill/plane processing including degassing, metal balancing and offset hatched planes•Embedded 3D quasi-static field solver for package model creation•User-customizable geometry DRC engine for in-process verification of complex rules•Direct integration with Calibre for mask signoff, assembly LVS and debug
Xpedition Substrate Integrator

芯片封装设计软件

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Benefits•Rapid hierarchical planning, prototyping and optimization of 2.5/3D heterogeneous assemblies•System connectivity management and visualization with cross-domain pin/signal mapping/shorting and system-level logical verification•User-definable rules for custom optimization of pin and ball-out assignments•System-level predictive SI/PI•Predictive data path flow planning•System Verilog integration•50M+ pin design support•Extensive input and output data formats•System-level LVS/STA verification through Calibre® 3DSTACK•Direct integration with Xpedition Package Designer for detailed implementation
Xpedition Package Designer

芯片封装设计软件

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Xpedition Package Designer高级封装 (HDAP) 设计软件

类型	软件名称	软件描述
PCB设计	Xpedition Enterprise	PCB设计软件：灵活推线、模块布局、草图布线、多人协同设计、多板协同设计
	PADS Professional	PCB设计软件：灵活推线、模块布局、草图布线
	PADS Standard	PCB设计软件：经典、易学易用、刷新最快
电路仿真	Hyperlynx SI/PI	电路信号完整性/电源完整性仿真分析软件
电路仿真	Hyperlynx DRC	专业电路EMI/EMC电气规则检查软件
FPGA仿真	Modelsim DE Verilog/VHDL	FPGA HDL仿真软件
FPGA仿真	Questa Core VLOG/VHDL	FPGA HDL仿真软件
DFM	Valor NPI	PCB新产品导入设计可制造验证软件
DFM	Valor Process Preparation	生产制造检查（DFM）软件
流体仿真	FloTHERM XT	热设计与仿真软件
流体仿真	FloEFD	流体设计于仿真软件
芯片设计	Tanner S-Edit	IC芯片原理图设计软件
	Tanner L-Edit	模拟IC芯片版图设计软件
	Tanner L-Edit MEMS	MEMS芯片版图设计软件
	Tanner L-Edit Photonics	光电芯片版图设计软件
封装设计	Xpedition Package Designer	SiP封装设计软件